发明名称 PACKAGE STRUCTURE OF PIEZOELECTRIC DEVICE AND METHOD FOR MANUFACTURING PIEZOELECTRIC DEVICE
摘要 PROBLEM TO BE SOLVED: To improve the dimensional accuracy of a piezoelectric device and to attain its cost reduction while meeting the requirements for downsizing and thinning. SOLUTION: The package 11 of a crystal resonator comprises a base 13 where an insulation layer 16 is formed on the surface by applying Tafram processing to an aluminium plate and an aluminium cover 14 formed in a box shape. Connection electrodes 17a and 17b formed on a vibration piece mounting surface of the base are electrically connected with external electrodes 18a and 18b on a base rear surface through via holes 15a and 15b formed in the base. The cover is joined to the top surface of the base mounted with a crystal vibration piece 12 and the via holes are subsequently sealed airtight by filling material 24. Both a crystal vibration piece of a thickness sliding mode and a tuning fork type one are mountable. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004248113(A) 申请公布日期 2004.09.02
申请号 JP20030037526 申请日期 2003.02.14
申请人 SEIKO EPSON CORP 发明人 ENDO HIDEO;SHINO HIDEO
分类号 H03H9/02;H03H3/02;H03H9/10;(IPC1-7):H03H9/02 主分类号 H03H9/02
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