ELECTRONIC PART

摘要

PROBLEM TO BE SOLVED: To provide a fuse 11 which can be mounted on a circuit board 19 by a reflow soldering method. SOLUTION: A fuse body 16 is housed in an envelope 13 together with an endothermic material 21 being solid at room temperature and having a boiling point of 230°C. The fuse 11 is mounted on the circuit board 19 by the reflow soldering method. Heat for mounting the fuse 11 makes the endothermic material 21 sublime. The endothermic action of the sublimation reduces a temperature rise in an envelope 13, to reduce a temperature rise of the fuse body 16 in the envelope 13. This allows the reflow soldering method to mount even a fuse having no margin in heat resistance or a fuse having difficulty in heat resistance on the circuit board 19. COPYRIGHT: (C)2004,JPO&NCIPI