| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component by which a high yield can be attained and the manufacturing cost per electronic component can be reduced and to provide its base substrate. <P>SOLUTION: Dummy cavities 21 are formed to surround the cavities 15 arranged two-dimensionally around the center of the bas substrate. The depth of a dummy cavity 21 is the same as that of a cavity 15 or, for example, ≥50μm, wherein the dummy cavity 21 does not penetrates the base substrate 10. The length of the dummy cavity 21 is the same as that of the cavity 15 in the arrangement direction of the cavities 15 or is, for example, equal to or greater than the length from a side wall surface of the cavity 15 to a SAW filter element 2. The thickness of a side wall between the cavity 15 and the dummy cavity 21 is, for example, ≥400μm, while taking into consideration the strength required in a side wall of a SAW device 11, thickness m to be removed by dicing and the improvement of manufacturing efficiency by high integration. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
