发明名称 MODULAR COMPONENT AND ITS PACKAGING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a modular component and the mounting method of the same which permits the integrated storage and mounting by temporarily retaining a plurality of individual components, constituting the modular component and having the same characteristics, as a pair or a set. <P>SOLUTION: A plurality of individual components 3a-3d, forming the modular component and having the same characteristics, are temporarily retained by fitting them into a plurality of recessed parts 2a-2d of a holder 1 under the positional relation same as the mounting positions on a circuit substrate 6. Then, the components are supplied by a taping 4 and the integrated mounting is permitted through attraction nozzle 5 for each holders 1. After mounting, the holder 1 is removed from the individual components 3a-3d. Other components mounted at the vicinity of the modular components on the circuit substrate 6 can be mounted simultaneously by temporarily retaining them in the holder 1. <P>COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004247448(A) 申请公布日期 2004.09.02
申请号 JP20030034656 申请日期 2003.02.13
申请人 NEC SAITAMA LTD 发明人 IMAI TETSUYOSHI
分类号 B65D85/86;H05K1/18;H05K3/34;H05K13/04 主分类号 B65D85/86
代理机构 代理人
主权项
地址