| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable package for containing electronic components, to which efficient hermetic sealing is possible with a small welding current without breaking the insulating substrate. SOLUTION: The package for containing electronic components comprises the insulating substrate 1 having a part 1a for mounting the electronic components 3 on the upper surface and a sealing metallized layer 6 applied to surround the mounting part 1a, and a metal lid 2 having a lower surface applied with a solder material 8 and bonded to the sealing metallized layer 6 through the solder material 8 by seam welding. The sealing metallized layer 6 has a thickness of 4-8μm and a 8-20μm thick plating layer 11 consisting of a nickel layer 9 and a palladium layer 10 formed sequentially is applied to the surface thereof. COPYRIGHT: (C)2004,JPO&NCIPI |
