| 发明名称 |
FILM FORMING APPARATUS AND METHOD |
| 摘要 |
PROBLEM TO BE SOLVED: To stabilize the film quality by shortening the waiting time when forming a film. SOLUTION: A heater H1 for heating a wafer W is provided in a wafer holding part 2 and the wafer W is heated while carrying the wafer W into a treatment chamber 11 by a robot arm 3. COPYRIGHT: (C)2004,JPO&NCIPI
|
| 申请公布号 |
JP2004247555(A) |
申请公布日期 |
2004.09.02 |
| 申请号 |
JP20030036446 |
申请日期 |
2003.02.14 |
| 申请人 |
SEIKO EPSON CORP |
发明人 |
OTAKI HIDEO;WATABE ATSUSHI |
| 分类号 |
H01L21/31;H01L21/02;H01L21/316;(IPC1-7):H01L21/31 |
主分类号 |
H01L21/31 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
