发明名称 DIELECTRIC MATERIAL AND PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide dielectric material wherein electric insulation in thickness direction can be ensured when conductive filler density is increased for increasing permittivity, and provide a printed wiring board including a capacitor of high capacity mass density and low loss. SOLUTION: Electrodes 4, 5 are arranged on both surfaces of a planar dielectric material 3 wherein planar conductive filler 1 is contained in insulating resin 2, and the material 3 is made to function as a capacitor. The conductive filler 1 is orientated in such a manner that plate surface of the planar conductive filler 1 and plate surface of the planar dielectric material 3 become almost parallel with each other. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004247382(A) 申请公布日期 2004.09.02
申请号 JP20030033317 申请日期 2003.02.12
申请人 MITSUBISHI ELECTRIC CORP 发明人 UCHIUMI SHIGERU;OKA SEIJI;SAMEJIMA SOHEI
分类号 H05K1/16;H01G4/18;H01G4/20;H01L23/12;(IPC1-7):H01G4/20 主分类号 H05K1/16
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