发明名称 |
Manufacturing circuit board arrangement involves inserting electrically conducting pin of length at least corresponding to board thickness into carrying board to pass through board with ends exposed |
摘要 |
<p>The circuit board arrangement has at least one carrying board (1) of electrically conducting material. The method involves making at least one electrically conducting cross-connection via at least one carrying board by inserting an electrically conducting pin (10) of length at least corresponding to the board thickness into the board so that the pin passes through the board with its ends (11,12) exposed. An independent claim is also included for the following: (a) an arrangement for manufacturing a circuit board arrangement.</p> |
申请公布号 |
DE10304867(A1) |
申请公布日期 |
2004.09.02 |
申请号 |
DE2003104867 |
申请日期 |
2003.02.06 |
申请人 |
HEIN HUBERTUS;HAERTL ERWIN |
发明人 |
HEIN HUBERTUS |
分类号 |
H05K3/32;H05K3/40;H05K3/46;(IPC1-7):H05K3/40;H05K1/02 |
主分类号 |
H05K3/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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