发明名称 PACKAGE FOR HOUSING LIGHT EMITTING DEVICE, AND LIGHT EMITTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To enhance mechanical strength of inner circumference of a through-hole of a frame and increase very much the light emitting efficiency of a light emitting element in order to diffuse and emit light effectively. <P>SOLUTION: A package for a housing of a light emitting device comprises a planar substrate 1 having a mounting part 1a for loading the light emitting element 3 on the upper face and a frame 2 layered on the upper face of 1, having a through-hole 2a for housing the light emitting element 3. The through-hole 2a is made so that the opening of the upper face side is larger than that of the lower face side and the shape of the cross section of the inner circumference has an arc profile which is swelling to the light emitting element 3. <P>COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004247701(A) 申请公布日期 2004.09.02
申请号 JP20030146632 申请日期 2003.05.23
申请人 KYOCERA CORP 发明人 UEMURA KYOJI;CHITOSE TOSHIYUKI;MORIYAMA YOSUKE
分类号 H01L23/02;H01L33/60;H01L33/62 主分类号 H01L23/02
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