发明名称 Thermally cooled imaging apparatus
摘要 Systems and methods for housing and/or cooling image sensors, for example, for use in video camera assemblies or any other application employing image sensors. The image sensors may be cooled within a sealed environment (e.g., vacuum sealed or dry gas sealed environment) to minimize the amount of power required by reducing heat transfer due to convection, and to substantially eliminate problems of fogging or condensation of the image sensor. In one embodiment, the systems and methods may be employed for cooling CMOS image sensors to improve low light performance of the CMOS sensors.
申请公布号 US2004169771(A1) 申请公布日期 2004.09.02
申请号 US20030732192 申请日期 2003.12.10
申请人 WASHINGTON RICHARD G;HOVANKY THAO D 发明人 WASHINGTON RICHARD G;HOVANKY THAO D
分类号 H04N5/225;(IPC1-7):H04N5/225 主分类号 H04N5/225
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