| 摘要 |
A semiconductor wafer includes a plurality of element-forming regions, a dicing line region and an insulating film. The dicing line region separates the element-forming regions from each other. The insulating film covers the element-forming regions and the dicing line region. The insulating film insulating film is formed of multi-layered insulating layers which insulate respective wiring layers of a multi-layer form. A separation region is formed at least in a portion of the insulating film located on the dicing line region, so that the separation region separates the insulating film on the dicing line region from the insulating film on the element-forming regions.
|
