PROBE PIN ZERO-POINT DETECTING METHOD AND PROBE DEVICE

摘要

The zero-point detecting method is performed prior to testing a wafer (W) for electric characteristics by contacting a body to be tested (W') on a table (6) with the probe pin (8A) of a probe card (8). The surface of a zero-point detecting plate (11) is made of electrically conductive material (e.g., copper). The zero-point detecting plate is used to detect a zero-point which is a position where the surface of the body to be tested contacts the probe pin. The zero-point detecting method comprises the steps of heating the zero-point detecting plate (11), blowing a reducing gas against the zero-point detecting plate (11) to reduce oxides of copper present on the surface thereof, cooling the reduced zero-point detecting plate (11) in a reducing gas atmosphere, lifting the zero-point detecting plate (11) until its surface contacts the probe pin (8A), and electrically detecting this act of contacting.