| 摘要 |
PROBLEM TO BE SOLVED: To improve the heat radiating property of a semiconductor device mounting structure in which a semiconductor device constituted by mounting a semiconductor chip on a heat sink and molding the chip with a resin and a substrate mounted with the semiconductor device are housed in a case, without placing any restriction on the electrical connection of the semiconductor chip nor impressing any excessive stress upon the chip. SOLUTION: The semiconductor device S1 is constituted by sealing a semiconductor chip 20 mounted on one surface 11 of the heat sink 10 and connected to leads 30 through wires 40 with a molding resin 50 and, at the same time, making the heat generated from the heat sink 10 radiatable from the other surface 12 of the heat sink 10. The semiconductor device S1 is mounted on a printed board 100 in a state where the leads 30 are connected to the board 100, and the device S1 and board 100 are housed in the case 200. Here, the end face 51 of the molding resin 50 on side of the surface 11 of the heat sink 10 is in contact with the lid 210 of the case 200 through a connecting member 70. COPYRIGHT: (C)2004,JPO&NCIPI |
