| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a resin composition that shows storage stability at room temperature in a half-hardened state like a thin film, reduced thermal deformation with low expansion coefficient, when it is hardened to form a coating film, and has high adhesion even when the surface roughness is very fine and low. <P>SOLUTION: This insulating resin composition comprises (A) an epoxy resin, (B) a carboxylic acid-modified acrylonitrile-butadiene rubber particles, (C) an epoxy group-bearing silane coupling agent and (D) an inorganic filler. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
