| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve the following problem: an electrode pad of a wiring board connected to an electrode of a semiconductor element through a metal bump comes off from an insulating substrate, so that connection reliability between the semiconductor element and the wiring board is deteriorated. <P>SOLUTION: This wiring board comprises: an insulating substrate 1 having a mounting part 1a, on which an electronic component 3 is mounted, on its own surface; a lot of electrode pads 5, formed on the mounting part 1a of the insulating substrate 1, to which an electrode of the electronic component 3 is connected through a metal bump 6; and a plurality of wiring conductors 2 lead out from the electrode pad 5 of the insulating substrate 1 to an outer surface. Each of the electrode pads 5 comprises: a main connection part 5a directly connected to the wiring conductor 2; and an auxiliary connection part 5b interposed between the main connection part 5a and the insulating substrate 1 to join the main connection part 5a and the insulating substrate 1. The main connection part 5a is formed from a tungsten and/or a molybdenum and a copper. The auxiliary connection part 5b is formed from a tungsten and/or a molybdenum and an iron group metal. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
