| 摘要 |
PROBLEM TO BE SOLVED: To provide a prepreg most suitable for combining and integrating a rigid printed wiring board and a flexible printed wiring board. SOLUTION: The prepreg, in which resin flow is 10% or less, is constituted by using a resin composition whose heat generation starting temperature measured by a differential scanning calorimeter is 130-150°C and peak temperature of heat generation is 220-250°C. A thermosetting polyimide resin composition is dissolved in an organic solvent to make a varnish, and then a fibrous base material is impregnated with it, and then a resin is cured to a B stage by heating, to make the prepreg. Depending on a condition in this time, the resin flow is controlled. COPYRIGHT: (C)2004,JPO&NCIPI |
