| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of designing a sputtering system where optimum sputtering cathode conditions are obtained, and the cracking and peeling of a target can be prevented. SOLUTION: The material and thickness of a backing plate and the thickness of a target are initially set, and using each thermal conductivity of the target, the baking plating and a bonding material, the thickness of the target and backing plate, the amount of the energy to be applied to the surface of the target and the region of the energy to be applied, and the temperature of the cooling face in the backing plate, the temperature distributions in the target and the backing plate are calculated by a finite element method. The shear stress occurring in the joint faces between the target and the backing plate is calculated from the above temperature distributions, and each thermal expansion coefficient and Young's modulus of the target and the backing plate by a finite element method. The material and thickness of the backing plate and the thickness of the target are decided so that the calculated maximum shear stress reaches the rupture strength of the bonding material or below. COPYRIGHT: (C)2004,JPO&NCIPI
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