| 摘要 |
PROBLEM TO BE SOLVED: To provide a material for an insulation film excellent in heat resistance, water absorbency, electric characteristics, etc., and capable of being made as having a high elastic modulus, a coating varnish for the insulation film, containing the same, and an insulation film and a semiconductor device using them. SOLUTION: This material for the insulation film contains a copolymer obtained by performing the reaction of a polyamide having a specific structure with a reactive oligomer as a film-forming component, the coating varnish for the insulation film containing the material and an organic solvent, the insulation film consisting of a layer of a resin having polybenzoxazole as a main structure, obtained by heat-treating them for performing a condensation reaction and cross-linking reaction and having fine pores, and an interlayer insulation film for multiply layered circuits and/or the semiconductor device having a surface-protecting layer consisting of the insulation film are provided. COPYRIGHT: (C)2004,JPO&NCIPI
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