| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for encapsulation and an encapsulated semiconductor device effective for improving the adhesiveness of the resin composition and a frame, improving the reflow resistance of the encapsulated semiconductor device and preventing the moisture degradation after reflow treatment, and having high reliability. SOLUTION: The resin composition for encapsulation contains (A) a filler having the maximum particle diameter of≤200μm and an average particle diameter of≥1μm and≤60μm, (B) an epoxy resin, (C) a phenolic hardener, (D) a phosphazene compound and (E) 4,4-dithiodimorpholine as essential components. The contents of the components A, D and E are 70-90 wt.%, 0.1-4 wt.% and 0.01-0.1 wt.%, respectively. The encapsulated semiconductor device is produced by encapsulating a semiconductor chip with the cured product of the resin composition for encapsulation. COPYRIGHT: (C)2004,JPO&NCIPI
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