| 摘要 |
A method of packaging a semiconductor chip (2) includes forming metallic bumps (5) on electrical contact areas (3) on an active surface (4) of a semiconductor chip (2). The semiconductor chip (2) is inserted into a mold (18, 19) and an electrically insulating material (6) is molded across the active surface (4) between the metallic bumps (5). The chip (2) is then removed from the mold (18, 19).
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