| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method thereof for enhancing the adhesiveness between a sealing resin and an electrode plate of the resin sealing type semiconductor device so as to improve the reliability. SOLUTION: Ni group alloy plating is applied to almost all the regions other than an AU-Si joining part of the electrode plate, and the semiconductor device is resin-sealed. Further, the plating applied to the electrode plate is configured with an Ni-P alloy plating film applied to the substrate side and an Ni-Co alloy plating film layered thereon. COPYRIGHT: (C)2004,JPO&NCIPI
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