METHOD FOR MANUFACTURING DEVICE, AND DEVICE MANUFACTURED BY USING THE SAME, METHOD FOR MANUFACTURING COMPOSITE SUBSTRATE, ELECTROOPTICAL DEVICE, AND ELECTRONIC APPLIANCE

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a device and so on, in which a yield is prevented from being lowered owing to a foreign matter produced by film floating even when the film floating (film peeling) has newly occurred especially through wet etching. SOLUTION: The method for manufacturing the device consists of using a composite substrate S comprising a semiconductor substrate with a semiconductor layer 206a to be a device forming layer and a supporting substrate 10A bonded together and forming the device from the semiconductor layer 206a, and has a plurality of steps to subject the composite substrate S to wet etching treatment. Subsequent to each of the wet etching treatment steps, peripheral edge parts of the semiconductor substrate are removed by dry etching treatment. COPYRIGHT: (C)2004,JPO&NCIPI