| 摘要 |
PROBLEM TO BE SOLVED: To provide an air-tightly sealed semiconductor device in which the ingress of moisture is effectively prevented to improve humidity resistance, and a manufacture of the air-tightly sealed semiconductor device in which the ingress of moisture is effectively prevented to improve humidity resistance. SOLUTION: In the semiconductor device, a semiconductor is mounted and air-tightly sealed on a semiconductor package wherein a humidity resistant layer composed of a steam non-permeable material is formed on the bottom of a box-like hollow resin molding to expose its one side. In its manufacturing method, the steam non-permeable material for forming the humidity resistant layer is inserted into a metal die of the box-like hollow resin molding together with a lead frame in advance, so as to expose its one side from the bottom of the molding. The semiconductor is then mounted on the package wherein the humidity resistant layer of which one side is exposed from the bottom of the molding, resulting from the insert molding using a resin composition for package molding, and the lead frames are integrated with the box-like hollow resin molding, and an opening is air-tightly sealed with a lid. COPYRIGHT: (C)2004,JPO&NCIPI |
