| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that is constituted by mounting a semiconductor chip on a heat sink and molding the chip with a resin and can be improved in heat radiating property without placing any restriction on the electrical connection of the semiconductor chip nor impressing any excessive stress upon the chip. SOLUTION: This semiconductor device is provided with the semiconductor chip 20 mounted on one surface 11 of the heat sink 10, leads 30 electrically connected to the chip 20, and a molding resin 50 which seals the heat sink 10, semiconductor chip 20, and leads 30 so as to encapsulate them. The other surface 12 of the heat sink 10 on the opposite side to the surface 11 is exposed from the molding resin 50. In this semiconductor device, part of the area of the surface 11 of the heat sink 10 excluding the mounting section of the semiconductor chip 20 is formed in a protruded section 14 protruded from the surface 11, and the front end of the protruded section 14 is exposed from the molding resin 50. COPYRIGHT: (C)2004,JPO&NCIPI |
