| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor element housing package wherein heat produced by the semiconductor element is efficiently radiated to the outside or to the atmosphere and the semiconductor element is strongly bonded to a heat sink, and to provide a semiconductor device using the same. SOLUTION: The semiconductor element housing package 8 has a heat sink member 1 furnished with a mount for a semiconductor element 11 and an insulating frame 5 installed above the upper surface of the semiconductor element 11 and accommodating wiring conductors 6, and a sealing resin 10 is injected into a recess 5a formed by the heat sink 1 and the insulating frame 5 for sealing the semiconductor element 11. A copper-made through metal 3 is buried at the center of a frame-shaped substrate 2 built of a matrix of tungsten or molybdenum, and copper, and a copper layer 4 is bonded to their upper and lower surfaces. The upper surface of the through metal 3 is as large as the semiconductor element 11, but is smaller than the lower surface of itself. Since the heat sink member 1 is excellent in heat conduction, heat produced by the semiconductor element 11 is efficiently radiated to the outside or to the atmosphere. COPYRIGHT: (C)2004,JPO&NCIPI |
