| 摘要 |
PROBLEM TO BE SOLVED: To expand the wiring forming area provided on a substrate under a heat sink by reducing the jointing area of the heat sink to the substrate at the time of mounting a semiconductor device having the heat sink on the substrate. SOLUTION: The semiconductor device S1 is constituted by sealing a semiconductor chip 20 mounted on one surface 11 of the heat sink 10 and leads 30 electrically connected to the chip 20 through wires 40 with a molding resin 50 and, at the same time, exposing the other surface 12 of the heat sink 10 from the resin 50. The semiconductor device S1 is mounted on a printed board 100 in a state where the leads 30 are connected to the board 100. The heat sink 10 is connected to the printed board 100 through connecting members 70, such as the solder etc., only in projecting sections 13 which are the peripheral section of the other surface 12 of the heat sink 10. COPYRIGHT: (C)2004,JPO&NCIPI |
