| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor sealing which does not contain bromine-based flame retardants nor antimony compounds and is excellent in moldability, reliability and flame retardancy and to provide a semiconductor device using it. SOLUTION: This epoxy resin composition for semiconductor sealing comprises (A) a biphenyl-type epoxy resin, (B) a phenol hardener, (C) a hardening accelerator , (D) an inorganic filler and (E) an inorganic nuclei covered with zinc molybdate. COPYRIGHT: (C)2004,JPO&NCIPI
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