发明名称 Compliant package with conductive elastomeric posts
摘要 An assembly including a first microelectronic element having a first surface and a plurality of contacts exposed at the first surface; a second microelectronic element having a top surface and a plurality of contacts exposed at the top surface; and conductive elastomeric posts formed by curing a conductive elastomeric material, wherein each of the contacts of the first microelectronic element is respectively aligned with one of the contacts of the second microelectronic element, and further wherein at least some of the contacts of the first element are connected to the respectively aligned contacts of the second element by the conductive elastomeric material.
申请公布号 US2004169263(A1) 申请公布日期 2004.09.02
申请号 US20030643701 申请日期 2003.08.19
申请人 TESSERA, INC. 发明人 FJELSTAD JOSEPH
分类号 H01L21/56;H01L21/60;H01L23/485;H01L23/498;(IPC1-7):H01L23/02 主分类号 H01L21/56
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