发明名称 |
Method and device for testing electronic devices |
摘要 |
The present invention provides a new electronic circuit board and a method of using such board to test electronic devices at elevated temperatures. The board comprises a steel base having a dielectric coating layer and a circuit formed on the layer. The circuit includes a connector region for attachment to an external electrical source and a mounting region for mounting sockets for supporting, powering and monitoring the electronic devices during elevated temperature testing. The board displays a leakage current of less than 10 muAmps at 350° C.
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申请公布号 |
US2004169522(A1) |
申请公布日期 |
2004.09.02 |
申请号 |
US20040794017 |
申请日期 |
2004.03.05 |
申请人 |
HEATRON, INC. |
发明人 |
MARTTER ROBERT H.;SUNDBERG CRAIG C.;GIARDINA RICHARD N.;FETSCHER BRIAN S.;DEUTSCHLANDER G. JAMES |
分类号 |
G01R31/28;H05K1/05;(IPC1-7):G01R31/02 |
主分类号 |
G01R31/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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