| 摘要 |
PROBLEM TO BE SOLVED: To provide a dicing method which requires no expensive equipment and is capable of directly monitoring a groove cut in the surface of a substrate from its opposite surface, making accurate alignment, and cutting out the substrate surely at desired positions. SOLUTION: The one surface (rear surface) 2b of the substrate 2 is held by a holding means, cutting grooves 11a and 11b as deep as prescribed are cut in its other surface (front surface) by a dicing blade, then the rear surface 2b of the substrate 2 is cut while the front surface of the substrate 2 is held by the holding means to expose the cutting grooves 11a and 11b cut in the front surface of the substrate 2 so as to enable the cutting grooves 11a and 11b to be visually ascertained from the rear surface 2b, an aligning operation is carried out so as to form cutting grooves at positions to enable them to confront the cutting grooves 11a and 11b, and then the substrate 2 is cut out from its rear surface with the dicing blade. COPYRIGHT: (C)2004,JPO&NCIPI |
