| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device wherein electrical continuity between an IC chip and a wiring board can be surely obtained while productivity is increased. SOLUTION: In a resin sheet 20, through-holes are formed at positions corresponding to the respective terminals 11, 13 of the IC chip 5 and the wiring board 3 and filled with conductor 9. The resin sheet 20 is arranged on the wiring board 3, and further, the IC chip 5 is arranged. The resin sheet 20 is heated while pressure is applied on a part between the IC chip 5 and the wiring board 3, a resin charge part 7 is formed, and the IC chip 5 and the wiring board 3 are electrically connected through the conductor 9. As a result, a semiconductor device 1 wherein the IC chip 5 is subjected to flip chip packaging on the wiring board 3 is obtained. COPYRIGHT: (C)2004,JPO&NCIPI
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