发明名称 Selective silicidation scheme for memory devices
摘要 A memory device and method of manufacturing thereof, wherein a silicide material is selectively formed over active regions of a memory device. A silicide material may also be formed on the top surface of wordlines adjacent the active regions during the selective silicidation process. A single nitride insulating layer is used, and portions of the workpiece are covered with photoresist during the formation of the silicide material.
申请公布号 US2004171213(A1) 申请公布日期 2004.09.02
申请号 US20030376461 申请日期 2003.02.28
申请人 WENSLEY PAUL;FAYAZ MOHAMMED FAZIL;COMMONS MARTIN 发明人 WENSLEY PAUL;FAYAZ MOHAMMED FAZIL;COMMONS MARTIN
分类号 H01L21/336;H01L21/44;H01L21/8234;H01L21/8242;H01L21/8244;H01L27/108;(IPC1-7):H01L21/823;H01L21/824 主分类号 H01L21/336
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