发明名称 |
Method and apparatus to deposit layers with uniform properties |
摘要 |
The present invention provides a method for forming a conductive film with uniform properties on a wafer surface that has features or cavities. During the process, the workpiece is rotated and laterally moved while an electrodeposition solution is delivered onto the wafer surface at a predetermined flow rate, and a potential difference is applied between the workpiece surface and the electrode. The workpiece is rotated about an axis at predetermined revolutions per minute so that an edge region of the workpiece has a first predetermined linear velocity due to the rotation. The workpiece has a second predetermined linear velocity due to the lateral motion. The second predetermined velocity may be larger than the first predetermined velocity. Further, the wafer may not be rotated.
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申请公布号 |
US2004168926(A1) |
申请公布日期 |
2004.09.02 |
申请号 |
US20030744294 |
申请日期 |
2003.12.22 |
申请人 |
BASOL BULENT M.;TALIEH HOMAYOUN |
发明人 |
BASOL BULENT M.;TALIEH HOMAYOUN |
分类号 |
B23H5/06;B24B37/04;C25D5/02;C25D5/06;C25D5/22;C25D7/12;C25F7/00;H01L21/288;H01L21/321;H01L21/768;(IPC1-7):C25D5/00;C25D5/48;C25D21/10 |
主分类号 |
B23H5/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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