| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface position detection method which allows the accurate detection of a wafer surface position at the time of focus measuring performed while alternately scanning a wafer, particularly in slit scanning exposure, and also to provide a scanning exposure apparatus. <P>SOLUTION: In the surface position detection method, the wafer 4 formed with a region having a pattern structure is relatively scanned with respect to surface position detection means 10-19, and surface positions of a plurality of detection points within the region are measured by the surface position detection means. The surface position detection method comprises a step of relatively scanning the wafer 4 alternately in a first direction 5a and in the inverse direction with respect to the surface position detection means 10-19 and holding a measured value for each scanning direction, a surface position calculating step of calculating a measurement variation between each of two detection points from the measured values which have been held, and a step of correcting the detection result of each detection point by the measurement variation when detecting the surface position of each detection point within the region by means of the surface position detection means. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
