| 摘要 |
PROBLEM TO BE SOLVED: To measure the characteristics of a mark detection system in a short time with high accuracy. SOLUTION: Prior to measuring the characteristics of an alignment detection system AS, a wafer holder 25 is separated temporarily from a wafer stage WST and returned onto the wafer stage (steps 132, 134). Subsequently, at least one mark on the wafer holder is detected (steps 136, 142) under a state of 0°where the wafer holder is oriented in a specified direction and under a state of 180°where the wafer holder is oriented in a direction rotated by 180°from the first state. Based on the detection results, characteristics of the alignment detection system are calculated (step 144). Characteristics of the alignment detection system, e.g. a TIS, can thereby be measured in a short time with high accuracy without being affected by thermal stress of the wafer holder or a strain resulting from the thermal stress. COPYRIGHT: (C)2004,JPO&NCIPI |
