| 摘要 |
PROBLEM TO BE SOLVED: To provide a plasma etching device capable of improving an etching efficiency and quickening an etching speed. SOLUTION: The plasma etching device is equipped with a housing for forming a sealed space, a lower electrode, arranged in the housing and equipped with a workpiece retainer for retaining a workpiece on the upper surface thereof, and an upper electrode arranged so as to be opposed to the workpiece retainer of the lower electrode and equipped with a gas injection unit having a plurality of injection ports for injecting plasma generating gas against the workpiece retainer. The lower surface of gas injection unit of the upper electrode is provided with an annular bulkhead coping with the circumference of the workpiece and formed so as to be projected. COPYRIGHT: (C)2004,JPO&NCIPI
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