发明名称 Method for fabricating image sensor
摘要 A method for fabricating an image sensor comprises forming an over coat layer on an upper face of a semiconductor substrate on which a color filter layer is formed, forming a microlens on the over coat layer; covering the microlens with a protection layer, back grinding a lower face of the semiconductor substrate, and removing the protection layer of the microlens. In this method, the protection layer is formed on the microlens of an image sensor and is subsequently removed after back grinding.
申请公布号 US2004171181(A1) 申请公布日期 2004.09.02
申请号 US20030720479 申请日期 2003.11.25
申请人 DONGBU ELECTRONICS CO., LTD. 发明人 LEE JAE SUK;KWON DAE HEOK
分类号 H01L27/14;H01L21/00;H01L27/146;H01L31/0232;H04N5/335;H04N5/369;(IPC1-7):H01L21/00 主分类号 H01L27/14
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