发明名称 Low temperature methods of bonding components and related structures
摘要 Methods of bonding two components may include positioning the components relative to one another to obtain a desired orientation. Once the desired orientation is obtained, the components can be bonded in the desired orientation with metal wherein a temperature of both components is maintained below a melting temperature of the metal while bonding. Related structures are also discussed.
申请公布号 US2004169064(A1) 申请公布日期 2004.09.02
申请号 US20040790967 申请日期 2004.03.02
申请人 发明人 RINNE GLENN A.;NAIR KRISHNA K.
分类号 B23K1/00;(IPC1-7):B23K31/02 主分类号 B23K1/00
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