发明名称 |
Low temperature methods of bonding components and related structures |
摘要 |
Methods of bonding two components may include positioning the components relative to one another to obtain a desired orientation. Once the desired orientation is obtained, the components can be bonded in the desired orientation with metal wherein a temperature of both components is maintained below a melting temperature of the metal while bonding. Related structures are also discussed.
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申请公布号 |
US2004169064(A1) |
申请公布日期 |
2004.09.02 |
申请号 |
US20040790967 |
申请日期 |
2004.03.02 |
申请人 |
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发明人 |
RINNE GLENN A.;NAIR KRISHNA K. |
分类号 |
B23K1/00;(IPC1-7):B23K31/02 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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