Fanless heat sink arrangement for a computer processor, has a heat conducting plate brought into close contact with the processor surface by a spring mechanism with a heat pipe in turn connected to the conducting plate

摘要

A sprung heat sink device has a heat-pipe (7) for cooling a processor (1) mounted on a motherboard. The device comprises a heat conducting plate (4) that is made from aluminum copper, graphite or a heat-conducting alloy. The plate dimensions are the same or larger than those of the processor. The heat pipe is connected to the plate parallel, perpendicular or at a defined angle to the processor surface. The heat conducting plate is sprung so that it is held tightly against the processor surface.