发明名称 LEAD-FREE GLASS, COMPOSITION FOR ELECTRONIC CIRCUIT BOARD, AND ELECTRONIC CIRCUIT BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a low dielectric constant and low dielectric loss lead-free glass from which a green sheet having excellent preservation stability is obtained, which is free from the deposition of crystal even when being fired at &le;900&deg;C, with which an electronic circuit board having excellent dimensional precision can be manufactured, and a composition for the electronic circuit board. <P>SOLUTION: The lead-free glass contains 68-72% SiO<SB>2</SB>, 19-22.5% B<SB>2</SB>O<SB>3</SB>, 3-7% Al<SB>2</SB>O<SB>3</SB>, 0-2.5% CaO, 1-6% SrO, and 2-6% CaO+SrO by mol. Preferably, the composition for the electronic circuit board is composed of 40-100% powder of the lead-free glass and 0-60% ceramic filler by mass. <P>COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004244271(A) 申请公布日期 2004.09.02
申请号 JP20030036639 申请日期 2003.02.14
申请人 ASAHI GLASS CO LTD 发明人 ONODA HITOSHI;USUI HIROSHI
分类号 C04B35/16;C03C3/091;C03C14/00;H05K1/03 主分类号 C04B35/16
代理机构 代理人
主权项
地址