| 发明名称 |
Verfahren zum Erzeugen verkapselter Chips und zum Erzeugen eines Stapels aus den verkapselten Chips |
| 摘要 |
<p>A process for producing encapsulated chips comprises producing a wafer (100) with surface contacts (104), arranging it on a separating substrate (106) and dividing into chips (102) through grooves, spray coating an encapsulating material between contacts and grooves and forming a wiring structure through the encapsulation.</p> |
| 申请公布号 |
DE10250621(B4) |
申请公布日期 |
2004.09.02 |
| 申请号 |
DE2002150621 |
申请日期 |
2002.10.30 |
| 申请人 |
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. |
发明人 |
BECKER, KARL-FRIEDRICH;BRAUN, TANJA;KOCH, MATHIAS;OSTMANN, ANDREAS;BOETTCHER, LARS;JUNG, ERIK |
| 分类号 |
H01L21/56;H01L21/60;H01L21/68;H01L21/78;H01L23/31;H01L23/538;H01L25/10;(IPC1-7):H01L21/50;H01L21/98;H01L25/065 |
主分类号 |
H01L21/56 |
| 代理机构 |
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代理人 |
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| 主权项 |
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