发明名称 COVER FILM FOR CARRIER TAPE OF ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a novel cover film for a carrier tape of an electronic component showing fundamental properties such as heat seal, easy opening properties. SOLUTION: The cover film for a carrier tape of an electronic component comprises an outermost first layer of biaxially stretched polyethylene terephthalate, a second layer of a polyethylene resin, a third layer of a polyolefin-based resin, and a fourth layer of a sealant, and shows a haze of not more than 30% characterized in that the sealant layer of the fourth layer is less than 30μm thick and is made of a resin composition comprising 50 to 100 wt.% of the sum of the following components (a) to (c) and 0 to 50 wt.% of the component (d) wherein the component (a) is a block copolymer of 50 to 95 wt.% of a styrene-based hydrocarbon and 5 to 50 wt.% of a conjugated diene-based hydrocarbon and its weight ratio is 5 to 50 wt.%, the component (b) is ethylene-α-olefin random copolymer and its weight ratio is 5 to 50 wt.%, the component (c) is a block copolymer of 10 to 50 wt.% of a styrene-based hydrocarbon and 90 to 50 wt.% of a conjugated diene-based hydrocarbon and its weight ratio is 5 to 70 wt.%, and the component (d) is an impact resistant polystyrene. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004244115(A) 申请公布日期 2004.09.02
申请号 JP20040064692 申请日期 2004.03.08
申请人 DENKI KAGAKU KOGYO KK 发明人 ISHII MASATOMO;HIGANO MASANORI;KOSUGI KAZUHIRO;SHIMIZU MIKIO
分类号 B65D73/02;B32B27/00;B65D65/40;(IPC1-7):B65D73/02 主分类号 B65D73/02
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