CURING RESIN, METHOD FOR PRODUCING SAME AND CURING RESIN COMPOSITION

摘要

A moisture curing resin having a silyl group at the end is disclosed which exhibits low viscosity when applied and shows excellent adhesion properties when the curing resin itself is used as an adhesive, a sealant or a coating compound. The curing resin has a silicon atom-containing group at the end of the molecule wherein one or more hydrolytic groups such as alkoxy groups, acetoxy groups and oxime groups are directly bound to a silicon atom, while having a thioether group and a hydroxyl group in the molecule. The main chain skeleton of the curing resin is composed of a polyoxyalkylene polymer, a (meth)acrylate polymer or a hydrocarbon polymer.