SEMICONDUCTOR IC DEVICE HAVING PAD ARRAY STRUCTURE FOR IMPROVING SIGNAL COMPLETENESS, REDUCING CHIP SIZE AND PROVIDING BONDING PAD ARRAY STRUCTURE APPROPRIATE TO LEAD ON CHIP STRUCTURE

摘要

PURPOSE: A semiconductor IC device having a pad array structure for improving signal completeness and reducing chip size is provided to form an array structure of bonding pads for improving the signal completeness by arranging efficiently the bonding pads. CONSTITUTION: A plurality of bonding pads(PD1-PDn) are arrayed only on one side of a semiconductor chip to be installed on one of peripheral circuit regions. The first lead group(BRD1-BRDn) is arrayed closely to one side of the semiconductor chip. The first lead group is connected to a part of the bonding pads by using a wire bonding method. The second lead group(URD1-URDn) is arrayed closely to the other side of the semiconductor chip. The first lead group is connected to the residual part of the bonding pads by using the wire bonding method.