发明名称 |
SC1 SUPPLYING APPARATUS AND METHOD USING ICM |
摘要 |
PURPOSE: An SC1 supplying apparatus using ICM is provided to perform a PID(proportional-integral-differential) control at a minimum distance from real equipment in use by introducing ICM for compensation of a temperature loss and a precise control. CONSTITUTION: A main supply unit adjusts the density of chemicals for CMP(chemical mechanical polishing) cleaning to a predetermined value and increases the temperature of the chemicals to a predetermined temperature(S100). A sub supply unit precisely controls the temperature of the chemicals supplied from the main supply unit(S110) and supplies the chemicals to CMP cleaning equipment(S120). The chemicals are composed of NH4OH, H2O2 and H2O that are mixed in a ratio of 1:4:20.
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申请公布号 |
KR20040076115(A) |
申请公布日期 |
2004.08.31 |
申请号 |
KR20030011456 |
申请日期 |
2003.02.24 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, DEOK YONG |
分类号 |
H01L21/304;(IPC1-7):H01L21/304 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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地址 |
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