发明名称 Electrical conduction array on the bottom side of a tester thermal head
摘要 An apparatus for testing an electrical device which includes fuses has a resilient, compressive, insulating base amounted to the underside of a thermal head. A plurality of conductive elements are mounted to the base in parallel relation. A number of these conductive elements are caused to be brought into contact with and bridge a fuse of the device when the thermal head is brought in dose proximity to the device. The conductive elements cause the fuse to be bridged, so that connection is provided between one side of the fuse and the other.
申请公布号 US6784668(B1) 申请公布日期 2004.08.31
申请号 US20010040002 申请日期 2001.11.07
申请人 ADVANCED MICRO DEVICES INC. 发明人 LAMBERT DONALD L.;REDDEN JOHN D.
分类号 G01R31/07;G11C29/02;(IPC1-7):H01H85/30;G01R31/02;G01R31/26;G11C29/00 主分类号 G01R31/07
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