Design of interconnection pads with separated probing and wire bonding regions

摘要

The present invention provides a solution to the problem of weakening bond integrity in integrated circuit devices due in part to test probes galling and weakening the interconnect pads during functional and reliability test probing. In doing so, the invention enables a lowering of the chance a bond wire or interconnect pad will be lifted during a wire bonding process or in normal operation of an integrated circuit device.