发明名称 Methods of selective oxidation conditions for dielectric conditioning
摘要 A method for conditioning or repairing a dielectric structure of a semiconductor device structure with selectivity over an adjacent conductive or semiconductive structure of the semiconductor device structure, such as a capacitor dielectric and an adjacent bottom electrode of the capacitor. The method includes exposing the dielectric structure and at least an adjacent surface of the conductive or semiconductive structure to an oxidizing atmosphere that includes at least one oxidant and hydrogen species. The at least one hydrogen species adsorbs to a surface of the conductive or semiconductive structure so as to substantially prevent passage of the at least one oxidant into or through the conductive or semiconductive structure. The oxidant oxidizes or repairs voids or other defects that may be present in the dielectric structure. Semiconductor device structures fabricated by employing the method are also disclosed.
申请公布号 US6784124(B2) 申请公布日期 2004.08.31
申请号 US20030379884 申请日期 2003.03.05
申请人 MICRON TECHNOLOGY, INC. 发明人 WEIMER RONALD A.;POWELL DON CARL
分类号 H01L21/02;H01L21/3105;(IPC1-7):H01L21/00 主分类号 H01L21/02
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