发明名称 Method and structure for repairing or modifying surface connections on circuit boards
摘要 A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.
申请公布号 US6784377(B2) 申请公布日期 2004.08.31
申请号 US20020205102 申请日期 2002.07.25
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 CHAMBERLIN BRUCE JOHN;HOFFMEYER MARK KENNETH;MA WAI MON;NUTTALL ARCH;STACK JAMES R.
分类号 H01R12/00;H05K1/11;H05K3/22;H05K3/40;H05K3/42;(IPC1-7):H01R12/04 主分类号 H01R12/00
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