发明名称 Semiconductor device
摘要 A semiconductor device according to the invention of the present application comprises a first semiconductor layer, a first insulating layer formed over the first semiconductor layer, a second semiconductor layer formed over the insulating layer, a protective element formed over the second semiconductor layer, an electrode pad, and a plurality of series-connected through holes for connecting the electrode pad and the protective element.Thus, a surge voltage applied across a diffused resistor can be lightened and hence an oxide film placed below the diffused resistor can be prevented from destruction.
申请公布号 US6784497(B2) 申请公布日期 2004.08.31
申请号 US20030337280 申请日期 2003.01.07
申请人 OKI ELECTRIC INDUSTRY, CO., LTD. 发明人 NAGAYA MASAFUMI
分类号 H01L21/768;H01L21/822;H01L23/62;H01L27/02;H01L27/04;H01L29/786;(IPC1-7):H01L23/62 主分类号 H01L21/768
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